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  • Multipurpose laser cutting machine
  • Multipurpose laser cutting machine
  • Multipurpose laser cutting machine
  • Multipurpose laser cutting machine
Multipurpose laser cutting machine Multipurpose laser cutting machine Multipurpose laser cutting machine Multipurpose laser cutting machine

Multipurpose laser cutting machine

  • Product Item : JSD-G7060A-1
  • Category: Laser equipment
  • Multipurpose laser cutting machine
  • Small face picosecond laser cutting machine
  • Saw blade slitting machine
  • Non metallurgical tool splitting machine
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Multipurpose laser cutting machine: PET/PI/PP/PVC electromagnetic explosion-proof film carbon fiber thin film picosecond laser cutting machine is a small surface picosecond laser cutting machine developed for scientific research institutions, with higher accuracy and wider applicability. It is designed for precise cutting and drilling of sensor chips, PET, PI, PVC film materials, ceramic sheets, metallic layer silver slurry etching, metal foil and other materials.
Materials that can be processed: electrode chips, FPC shapes, FPC auxiliary materials, PET, PI films, ceramic sheets, various thin films, etc
Customizable non-standard laser cutting to achieve automated production.
Edge effect: minimum thermal effect, smooth and tidy, carbonized 5-20 μ m
Output pulse width ≤ 15ps,
The machining accuracy is 20 ± 5 μ,
CCD alignment accuracy ± 5 μ m
Applicable scope mainly applies to industries such as PCB, CVL, FPC, RF, etc; Cutting various types of films and auxiliary materials such as FPC soft board, covering film, PET film, PI film, PP film, adhesive film, copper foil, explosion-proof film, electromagnetic film, FR4, 3M adhesive, PI reinforcement, PE film, etc. It can also be used to cut various substrates, such as ceramics, silicon wafers, aluminum foil, PTFE, etc。



Laser cutting machine parameters


Processable materials Electrode chips, FPC shapes, FPC accessories, PET, PI films, metal foils, ceramic films, and various thin films, etc
Cutting efficiency 800mm-7000mm/s (Different processes result in varying efficiency)
Processing method Single workbench pulse width ≤15ps
size 17001550-1750mm Cutting line width 15±5μm
weight 2200kg Number of CCDs 1 PCS
Cutting size 700x600mm CCD positioning accuracy ±3µm
Comprehensive accuracy ±25µm Focus size 25-30μm
Repetitive accuracy ±2µm Memory capacity 500G
Positioning accuracy ±3µm Exhaust diameter 70mm
Laser power 15W/30W compressed air ≥0.6Mpa
Scanning range ≤50mm50mm cooling Thermostatic chiller
Compensation capacity ≤1%(Adjustable threshold) temperature 23±2(No condensation)
Pulse frequency 600kHz-1000kHz bearing 600Kg/m²
Splicing accuracy ≤10μm consume power 8.5KW/380V 50-60HZ

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