Infrared picosecond laser cutting machine

Infrared picosecond laser cutting machine

Product Item : JSD-G6050Z-1
Category： Laser equipment
Multipurpose laser cutting machine
Small face picosecond laser cutting machine
Infrared picosecond laser cutting machine
Non metallurgical tool splitting machine
INQUIRY EMAIL

The infrared picosecond laser cutting machine can be applied to LED sapphire substrate cutting, LED sapphire filament holder cutting, mobile phone sapphire HOME key cutting, camera protection lens cutting, sapphire glass mobile phone screen cutting, mobile phone, watch and wearable device sapphire cover cutting, etc.

Laser	Fiber laser
Laser wavelength	1064nm
Rated power	10-20W
positioning accuracy	±2µm
Repetitive accuracy	±1µm
Processing scope	400mmX300mm(Customizable)
CCD positioning accuracy	±3µm
Processing area	40x40mm/110x110mm
Mirror repetition accuracy	±1µm
dimensional accuracy	<30µm
Position accuracy	<50µm
Collapse volume	≤0.1mm
Processable formats	Standard Gerber files, DXF files, PLT files, etc