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  • Small face picosecond laser cutting machine
  • Small face picosecond laser cutting machine
  • Small face picosecond laser cutting machine
  • Small face picosecond laser cutting machine
Small face picosecond laser cutting machine Small face picosecond laser cutting machine Small face picosecond laser cutting machine Small face picosecond laser cutting machine

Small face picosecond laser cutting machine

  • Product Item : JSD-G4030A-1
  • Category: Laser equipment
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  • Small face picosecond laser cutting machine
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Small face picosecond laser cutting machine
This is a small surface picosecond laser cutting machine developed for scientific research institutions, with higher accuracy and wider applicability. It is designed for precise cutting and drilling of sensor chips, PET, PI, PVC film materials, ceramic sheets, metal layer silver slurry etching, metal foil and other materials.
Materials that can be processed: electrode chips, FPC shapes, FPC auxiliary materials, PET, PI films, ceramic sheets, various thin films, etc


High processing accuracy: small format platform, automatic positioning and focusing, higher accuracy
Structural optimization: Fine cutting of various materials, etching of lines, and drilling of micro holes are very suitable for shaping
Stable and environmentally friendly: smoking up and down, electrostatic technology, and vacuum adsorption platform are more stable and environmentally friendly
Edge effect: minimal heat effect, smooth and tidy, carbonized 5-20 μ m
Output pulse width ≤ 15ps,
Processing accuracy of 20 ± 5 μ m,
CCD alignment accuracy ± 5 μ m

Applicable scope mainly applies to industries such as PCB, CVL, FPC, RF, etc; Cutting various types of films and auxiliary materials such as FPC soft board, covering film, PET film, PI film, PP film, adhesive film, copper foil, explosion-proof film, electromagnetic film, FR4, 3M adhesive, PI reinforcement, PE film, etc. It can also be used to cut various substrates, such as ceramics, silicon wafers, aluminum foil, PTFE, etc.






Small face picosecond laser cutting machine Small face picosecond laser cutting machine


Small face picosecond laser cutting machine Small face picosecond laser cutting machine


Small face picosecond laser cutting machine Small face picosecond laser cutting machine

Small face picosecond laser cutting machine



##Marble base

Gantry structure, marble columns
The high rigidity of the crossbeam body
Stability and seismic resistance
##Z-axis design
High precision Z-axis design,
Adjust the laser focal length to ensure cutting
The high precision of the product
##Humanized operation
Fully realize equipment automation throughout the process
One click operation, clear button operation,
Within reach
##High strength body
Ductile iron welded body,
Completely eliminate stress and reduce body deformation,
Ensure accuracy remains unchanged for a long time





Carbonization effect
5-20 µ m tolerance: ± 0.03mm.
The apparent carbonization range is extremely small (depending on the material)
Output pulse width ≤15ps CCD field of view 3.5*4.5mm
Equipment weight 1500kg-2500kg Number of CCDs 1^
Cutting format size 400300mm CCD alignment accuracy ±5μm
Processing accuracy 20±5μm Focus size 10-25μm
Spot diameter 25±5µm Memory capacity 500G
Minimum machining line width 20-25µm(Depending on material thickness) Fixed method Vacuum adsorption
Motor architecture Fixed beam gantry style compressed air ≥0.6Mpa
laser power 15W/30W(UV) Laser cooling method Thermostatic chiller
Galvanometer scanning range 40mm40mm ambient temperature 20-30℃(No condensation)
Compensation ability for inflation and contraction ≤1%(Adjustable threshold) relative humidity 45%-75%
Splicing accuracy ≤±10µm Power consumption of the entire machine 4.5KW/380V 50-60HZ
Equipment size L1200mm1150mm1750mm

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