Thin film material laser cutting machine

Thin film material laser cutting machine

Product Item : JSD-G6050R-2
Category： Laser equipment
Multipurpose laser cutting machine
Small face picosecond laser cutting machine
Thin film material laser cutting machine
Non metallurgical tool splitting machine
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Laser cutting machines for thin film materials are mainly used for cutting thin film materials, covering various types of thin films such as roll to roll, PET film, PI film, PP film, adhesive film, copper foil, explosion-proof film, electromagnetic film, Sony adhesive, etc.

High precision: comprehensive machining accuracy ± 25 µ m
Fast speed: cutting efficiency can reach up to 7000mm/s
Low cost: From feeding to processing to receiving, one click solution to all operational problems, saving labor costs
Efficient: Equipped with dual workbenches, the work efficiency is twice as enjoyable.

Customizable non-standard laser cutting to achieve automated production.

Processable materials	Covering film (CVL) flexible board (FPC) soft hard bonding board (RF) thin multi-layer board
size	L1550xW1650xH1700(mm)	Electricity demand	380V50-60HZ/9KW
weight	2500kg	ambient temperature	23℃±2℃(No condensation)
Cutting size	Dual Platform 600*500(mm)	Cutting line width	25±5μm
Processing accuracy	±25µm	Cutting efficiency	800mm-7000mm/s(Different processes result in varying efficiency)
Repetitive accuracy	±2μm	Memory capacity	500G
positioning accuracy	±3µm(After compensation)	Air outlet	50mm
laser power	UV picosecond:30W Green picosecond:30W/60W	compressed air	pressure≥0.6MPa
Galvanometer scanning	≤50*50mm	Cooling method	Thermostatic chiller
Pulse frequency	300-2000KHZ	Number of CCDs	2 pcs
Inflation and contraction compensation	≤1%	CCD range	4.6x3.2mm
Splicing and cutting	have	CCD accuracy	±5μm
pulse width	≤15ps	Focus size	10-25μm
Laser wavelength	UV picosecond: 355nm Green picosecond: 532nm	Splicing accuracy	≤10μm